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WIRE BONDING – Ag / Cu WIRE

Advanced Si node Si node Qualification Envelope

Technology Offering

Applications PCC Ag
Laminate BGA Applicable Applicable
SSB Feasible Feasible
Al thickness (Å) ~5000 ~5000
Inert gas Forming/ N2 Forming/ N2/Gas free

No-gas Ag wire development

Development status 2016 2017
Wire composition selection / WB feasibility test 3N Ag + Au coating
Parameter evaluation Working range set up
Rel. test MRT L3 + HAST 504hrs pass
Parameter fine-tuning On-going
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