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DBG PROCESS : DICING BEFORE GRINDING PROCESS

DAG(conventional) : 50um ↑, DBG : 50um ↓(20~50um)

DBG

Producer Process

Half Cut, Protection Tape Lamination, Back Grinding, Tape Mount, Protection Tape Removal, DAF Cut, DAF Expanding
Half Cut System DAF Cut System DAF Expander
Model DFD6361HC DFL-7160 DDS2300
Key Tech Minimized side chipping Responding to Die Shift DAF type Proper DAF separation
Key Para High precision Cutting depth control ( +/- 5um ) Laser cutting
Cooling: Temp / Amount / Speed Heating: Temp / Amount / Speed

Performance

High Performance HVM Available Competitor 2015 2H 2016 1H 2016 2H
Wafer Back
Grinding
Wafer Thickness(Max) 30um 25um 40um 25um 20um 20um
Saw Street (Min) 50um 50um 50um 50um 45um 45um

SDBG : Stealth Dicing Before Grinding

High Chip Strength, Zero scribe lane, High quality chip separation

SDBG

Producer Process

Protection Tape Lamination, Stealth Dicing, Back Grinding, Tape Mount, Protection Tape Removal, DAF Expanding
Stealth Dicing DAF Expander
Model DGP8761 DDS2300
Key Tech Non Chipping & Higher Chip Strength Narrow Gap Scribe Lane Proper DAF separation
Key Para Wafer 특성에 따른 Laser Control
Cooling: Temp / Amount / Speed Heating: Temp / Amount / Speed

Performance

HVM Available Competitor 2015 1H 2015 2H 2016
Wafer Thickness(Max) 200um 200um 200um 300um 400um 450um
Saw Street (Min) 40um 40um 40um 30um 20um 20um
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