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Flow Chart of General Reliability test

1. Visual Inspection → 2. EL Test → 3. SAT Inspection → 4. Dry Bake → 5. Temp & Humidity → 6. Reflow → 7. EL Test → 8. SAT Inspection → 9. REL Test → 10. EL Test

MSL (Moisture Sensitivity Level) Test

In case of surface mount type pkg that the semiconductor is directly assembled on the substrate surface, MSL(Moisture Sensitivity Level) is to test for the time specified in a constant humidity. It means the specific stress and process to be performed before the reliability test in a comprehensive sense.

Temp & Humidity

Reflow

Conditions
Level Standard Soak Requirements Floor life
Condition Time (hours) Condition Time
1 85℃/85% RH 168 ≤30℃/85% RH Unlimited
2 85℃/60% RH 168 ≤30℃/60% RH 1 year
2a 30℃/60% RH 696 ≤30℃/60% RH 4 weeks
3 30℃/60% RH 192 ≤30℃/60% RH 168 hours
4 30℃/60% RH 96 ≤30℃/60% RH 72 hours
5 30℃/60% RH 72 ≤30℃/60% RH 48 hours
5a 30℃/60% RH 48 ≤30℃/60% RH 24 hours
6 30℃/60% RH 6 ≤30℃/60% RH 6 hours

TC (Temperate Cycle) Test

In order to fine out exactly the defect or the thermal characteristics as applying a thermal stress to the sample on a semicondutor device The equipment of thermal shock testing is characterized by applying a stress to the sample through a temperature change of short time.

Conditions
Test Condition Nominal
Ts(min)(℃) with Tolerances
Nominal
Ts(min)(℃) with Tolerances
A -55(+0, -10) +85(+10, -0)
B -55(+0, -10) +125(+15, -0)
C -65(+0, -10) +150(+15, -0)
G -40(+0, -10) +125(+15, -0)
H -65(+0, -10) +150(+15, -0)
I -40(+0, -10) +115(+15, -0)
J -0(+0, -10) +100(+15, -0)
K -0(+0, -10) +125(+15, -0)
L -55(+0, -10) +110(+15, -0)
M -40(+0, -10) +150(+15, -0)
N -40(+0, -10) +85(+10, -0)

uHAST (Unbiased High Accelerated Stress Test ) / PCT (Pressure Cooking Test)

The Temperature Humidity Bias(THB) test is developed to compensate for the long hours of test what the humidity test unsaturated type of an autoclave. In General, the THB test is required to more than 1000hour but uHAST is able to obtain results within 96~264hous. So HAST has been widely used recently. The uHAST after MSL(Precondition) is to evaluate the corrosion of the metal line and bonding pad at temperature 130℃ and relative humidify of 85%.

Conditions
Test Condition
(dry bulb ℃)
Relative Humidity
(%)
Temperature
(Wet bulb, ℃)
Vapor Pressure
(psia/kPa)
Duration
(hours)
uHAST 130 ± 2 85 ± 5 124.7 33.3/230 96 (-0,+2)
110 ± 2 85 ± 5 105.2 17.7/122 264 (-0,+2)
PCT 121 ± 2 100 - 29.7/205 -

HTSL (High Temperate Storage Life)

It is to test for any effect of the product that is kept into high temperature for a long time, the purpose of test is to evaluate the long-term reliability of the product without Electrical stress.

Conditions
Condition Temperature
A +120 (-0/+10) ℃
B +150 (-0/+10) ℃
C +175 (-0/+10) ℃
D +200 (-0/+10) ℃
E +250 (-0/+10) ℃
F +300 (-0/+10) ℃
G +85 (-0/+10) ℃
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