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SFA 반도체
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icon imageR&D

Analysis Measurement Tool Image
Mechanical Warpage at Room Temp. after Mold Process Warpage at high temp. in Reflow Process Shadow Moire, TMA, DMA
Wire Process Drop/Bend Test Die Crack Outsourcing
(Drop/bend Test)
Thermal Theta JA (Natural Convection) Theta JA (Forced convection) Theta JC Theta JB Outsourcing
Electrical S-parameter extraction (Insertion / Return Loss) EM Field / Radiation Full-wave Spice Extraction Network Analyzer
RLC / IBIS Extraction Characteristic Impedance Digital Signal Analyzer
RLC / IBIS Extraction Probe Station
TDR / TDT Analysis (Eye-diagram)
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