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SFA 반도체
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Package Type Design Tools Design Image
S-LSI CSP(FBGA) Cadence → Design Tool
CAM 350 → DRC Tool
Stack CSP, 3D Modeling
FCCSP FCCSP with CUF, Hybrid FCCSP
FCBGA FCBGA with 1-Piece Lid, MCM FCBGA
Memory eMMC / eMCP eMMC_17Stack, eMCP_7Stack
Card / BOC uSD 9Stack, BoC
L/F QFN / TSOP Auto CAD → Design & DOC 3-Row QFN, Flip Chip QFN, Routable QFN
Bumping WLCSP / MEMS CAM 350 → DRC Tool
Auto CAD → Design & DOC
Cu Pillar / u Bump, Wafer Bumping(RDL), MEMS
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