Bumping Technology Overview
Wafer bumping is replacing wire bonding as the interconnection of choice for a growing number of components. The broad term “wafer bumping” will be defined as the process by which solder, in the form of bumps or balls, is applied to the device at the wafer level. The use of wafer bumping is driven either by performance, form factor or array interconnect requirements. The ability to properly design the device for bumping will have direct bearing on manufacturability, reliability, and cost savings from wafer fabrication through component assembly.
Bumping Business Portfolio
Provide Turnkey Business Solution to Customer !
「Bump, Wafer Sort, F/Chip Assembly, Final Test or DPS 」 Turn-key Service
Bumping Product Portfolio