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Semiconductor Package Design

The skilled design engineers of SFA Semiconductor can offer a variety of solutions to develop new products. We also supports electrical and thermal designs to improve product performance and have a lot of experience in low-cost designs.

Available Design Service

Package Type Design Tools Design Image
S-LSI CSP(FBGA) APD / SiP (Design Tool)
CAM350 (DRC Tool)
Stack CSP, SiP
FCCSP FCCSP with CUF, Hybrid FCCSP
FCBGA FCBGA with 1-Piece Lid, MCM FCBGA
Memory eMMC / eMCP eMMC_17Stack, eMCP_7Stack
Card / BOC uSD 16Stack, BoC
L/F QFN / TSOP Auto CAD (Design & DOC) Multi Row QFN, Flip Chip QFN, Routable(MIS) QFN
Bumping WLCSP / CuP AutoCAD (Design & DOC)
CAM 350 (DRC Tool)
Cu Pillar / u Bump, Wafer Bumping(RDL)
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